PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD5L SOT-23 All Date CodesMatte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0160
MCP6271T-E/OT |
RFQ for MCP6271T-E/OT |
![]() |
| Technical/Catalog Information | MCP6271T-E/OT |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Packaging | Cut Tape (CT) |
| Amplifier Type | General Purpose |
| Number of Circuits | 1 - Single |
| Package / Case | SOT-23-5 |
| Slew Rate | 0.9 V/s |
| Gain Bandwidth Product | 2MHz |
| Current - Supply | 170A |
| Current - Output / Channel | 25mA |
| Voltage - Supply, Single/Dual (±) | 2 V ~ 6 V |
| Output Type | Rail-to-Rail |
| -3db Bandwidth | - |
| Current - Input Bias | 1pA |
| Operating Temperature | -40°C ~ 125°C |
| Voltage - Input Offset | 3000V |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP6271T E OT MCP6271TEOT MCP6271T E OTCT ND MCP6271TEOTCTND MCP6271T-E/OTCT |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP6271T-E/OT | - | - | - |